Our blanket photoresist coatings for semiconductor test wafers are processed in a dedicated, class 100 cleanroom. Wafer sizes range from 50mm diameter to 300mm diameter. Coating thicknesses range from 0.5 microns to 10 microns.
Blanket photoresist coatings may also be patterned per customer specifications. Coating thickness and uniformity can be certified at the customers request.
A photoresist is a light-sensitive material used in several industrial processes, such as photolithography and photoengraving, to form a patterned coating on a surface.
Photoresists are classified into two groups: positive resists and negative resists.
Photolithography, also termed optical lithography or UV lithography, is a process used in microfabrication to pattern parts of a thin film or the bulk of a substrate. It uses light to transfer a geometric pattern from a photomask to a light-sensitive chemical “photoresist”, or simply “resist,” on the substrate. A series of chemical treatments then either engraves the exposure pattern into, or enables deposition of a new material in the desired pattern upon, the material underneath the photo resist